SOLDERLESS BREADBOARD - 830 HOLES
- base socket: twin columns of 5 x 63 terminals
- bus strip: 2 buses of 50 connected terminals are arranged in 2 rows
- voltage: max. 30 V
- current: max. 3 A
- external body: ABS with colour printing
- clips: stainless steel
- base socket: 1
- bus strip: 2
- tie points: 830
- 14-pins IC capacity: 9
- binding post: 0
- dimensions: 165.5 x 56.5 x 8.5 mm
- weight: 74 g
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Due to constant product improvements the actual product appearance might differ from the shown images. Product images are for illustrative purposes only.